Abstract
In this study we use the Atmosphere Pressure Plasma Jet（APPJ） system to form an anti-adhesion coating on the imprinting mold, which could be flat or roller typed. It is fast, vacuum free and low temperature comparing to Self-assembled Monolayer by vapor phase deposition. Samples of Si wafer, Ni film (by e-gun vapor deposition) and Ni-P film (by electroless plating) were prepared. These materials were desirable for the robust mold of imprinting. After the treatment on the samples, the surface energy was decreased and, however, roughness raised. Using an optimized process parameter, the water contact angle was 121o, surface lower than 13mN/m and roughness lower than 1.1 nm. Also, an ESCA was applied to analyse the chemical compose of the coating, the CFx species causing a low surface energy were founded of which. Finally the adhesion force was measured by the AFM force curve and it was lower than 14.64 nN after treatment. Then the adhesion results were compared to the prediction by adhesion theory. We have used the APPJ system to form an anti-adhesive coating on Si, Ni and Ni-P in just few minutes. The Si, Ni and Ni-P had achieved the nearly same contact angles about 120o and low adhesion force after the treatment. A thin, uniform and roughness controlled anti-adhesion coating with low surface energy was being coated on the structured mold with nano-scale patterns, thus the sticking was avoided.