Abstract
Through the development of Opto-electronic industry such as liquid crystal display, flexible display expand very fast, lots of substrate and thin film are made by transparent material. In the process to become consumer products, there is an essential issue of inspection for the quality control, so how to measure the topography and geometric size of transparent object become more and more important. In this paper, we discuss and verify the three-dimensional topography measurement by Differential Interference Contrast(DIC) microscopy. Differential Interference Contrast(DIC) microscopy was an image processing method that was usually used to enhance the contrast between transparent specimens and background. According to its principle, it may be also apply to three-dimensional topography measurement of transparent objects. But as a profile measurement technique, it is important in the integration process, so we propose a quantitative phase restoration method, called Modified Fourier Phase Integration(MFPI), that depress the image noise effect. Next, we set an experiment to validate the integration method in reality and research the different optical path type: reflected and transmitted DIC. Finally, we construct a three-dimensional topography measurement equipment of transparent object.