Abstract
Currently, 3D integrated circuits have received wide-spread interests and allow the realization of high density, flexible and multi-function hybrid systems. TSV is main stream technology since it gives rise to the high packing density and operates under low power. However, the fabrication process of TSV requires the formation of bumps and high aspect ratio structure, leading to higher cost, reliability and KOZ issues. In this thesis, a new concept of contactless multi-channel magnetic transmission interface is proposed and demonstarted. This data transmission module uses a micro-coil as magnetic field generator and using a MTJ structure as magnetic field sensor. Further, multi-channel magnetic transmission interface is proposed in this paper by employing MTJ sensor array to detect interaction between multiple coil inputs. This approach provides a possible new direction for high density contactless connection for 3D IC applications.