Abstract
Delamination of package for lead frame type is an important reliability problem.Joint Electron Device Engineering Council (J-STD-020D) Moisture Sensitivity Level3of reliability test is for customer or surface-mount technology (SMT) to apply at board level or in module assembly. This implies that the floor life of Level 3 components can be guaranteed for 168 h under a 300C and 60% RH production environment after opening a dry pack. In this study, applied function attribute analysis of TRIZ problem-define methods to research clamping preheating, transfer molding, open mold and ejection that brought harmful or insufficient functions in the molding process.The integration of contradiction matrix, 39 engineering parameter, 40 inventive principles, and separation strategies, substance-field analysis 76 standard solutions generating concepts and applies to the lead frame package type. At first, to verify IC whether it is delaminated after conceptual design, then base on JEDEC-MSL-3 test condition to confirm whether it pass MSL-3. Finally, to estimate each stage of contribute which can reduce delamination. The research results were as bellows: 1.The concepts design of these process relate to the Inventive Principles which includes 39.Inert Atmosphere, 24.Intermediary, 3.Local Quality, 14. Spheroidality- Curvature, 30.Flexible shells and thin films, separation strategies in space,76 standard solutions of substance-field analysis. 2.The package component of SOT223 passes JEDEC-MSL-3. 3.The idea were effective to improve delamination of package component for lead frame.