Abstract
In this paper, we use large cohesion of the solder paste, combine with constrain of cavity and TSV, having the advantage of faster filling TSV. The technology can overcome the current widespread use of plating copper fill TSV issues. This technology can significantly reduce the time of filling TSV. If do not consider the time of the heating and cooling. This process time is only a few seconds. And significantly simplifies the electroplating copper to fill TSV process steps. Use once solder reflow, micro pad, micro bump and TSV can be formed at the same time. And we use cohesion of the solder paste, can improve disadvantage of copper electroplating filling via. In this study not only use of numerical software design parameters, also actual apply this technique to interposer and MEMS actuator. And we use 3D IC Integration type, integrated with interposer and MEMS actuator. To prove the practicability of faster filling TSV interconnects using solder reflow technology.