Abstract
Many devices of MEMS（Micro-electro-mechanical system）have maturely developed and applied with electrical systems in our daily life. During designing, the integration of interface of the mechanical devices and electrical circuits is very important. The hybrid-connected integration and monolithic single chip integration are the most two common solutions. With the high integration of monolithic system, it is more difficult to be achieved than hybrid-connected configuration. This study demonstrates an capacitive accelerometer sensor system based on hybrid integration interface consists of mechanical structure realized on SOG（Silicon On Glass）silicon substrate and capacitive sensing integrated circuits. It also proposes a complete design flow of MEMS device and analysis of interface between mechanical and electrical parts.