Abstract
At present, ceramic materials are extensively used in substrate materials of semiconductor, mechanical and photoelectric devices. Not only brittle materials are very difficult to machining in mechanical way, but also the requirement increase with time rapidly. Free Abrasive machining for brittle materials had been used in the past, however its efficiency was too low and lots of slurry was wasting in machining process. In order to gain high accuracy and fine surfaces quality in industrial requirement more efficiently, we uses Resin-bonded diamond wire saw in Silicon wafer slicing. Effects of processing parameters on the performance of resin-bonded diamond wire sawing process, including material remove rate, machined surface roughness of the wafer, and life of the wire saw, are investigated in this paper., we expect to elongate wire life and improve diamond retention of the wire by using different fillers of resin-bonded diamond wire composites. Analyzing the importance of rocking-motion in silicon wafer slicing process in addition. The results showed that diamond wire life was 73% ~192% elongated with Copper fillers, and 34%~65% elongated with Nitride fillers added to the diamond composite. Slicing Silicon wafer with rocking-motion displays 60% material remove rate improving in maximum.