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無接觸式堆疊前中介層測試
Thesis

無接觸式堆疊前中介層測試

許凱翔
Masters, 國立清華大學, 資訊工程學系
2015

Abstract

中介層 測試 熱分析 機器學習 堆疊式晶片 interposer testing thermal analysis machine learning 3D-IC
Interposers are essential for integrating multiple dies in staked-die products. However, the traditional testing mechanism is not appropriate for interposers. Therefore, in this work, we proposed a contactless testing methodology for pre-bond interposers. Also, to improve the production yield, surface defects and inner defects will be both examined. Our testing mechanism dedicates to detecting defective interposers by thermal images. Critical features will be extracted from thermal images and will be used to construct machine learning algorithms to determine whether the interposer is defective automatically. Experimental results show that our contactless testing mechanism can efficiently improve the production yield of the interposers from average 72.13% to average 96.25%.

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