Abstract
One of the key technologies of (Micro electromechanical System) MEMS is the package and integration of different modules such as IC circuits, microsensors, and microactuators into functional microsystems. Full integration of circuits and MEMS devices suffer from not only material limitation but also process compatibility problems; the increase of mask number would also significant decrease the process yield. In this thesis, with MCMs technology, studied a new type of assembly technique, in which a number of different components, from different wafers and technologies, onto a common host substrate with plug-in electrical contacts. The contact pins to connect the silicon die and the common host substrate are made of non-planar thick electroplating copper. The 3-D structure on the cantilever tips not only are designed to provide the mechanical strength to hold the silicon die, but also provide electrical contacts and realized by micromachining technology. The fabrication process of silicon die is very simple and cut by dicing-saw to eliminate difficulties in MEMS devices processing. The pitch of the pad is 150 um, and the contact resistance is lower than 0.1Ω/pad.