Abstract
Abstract Flip-Chip-on-glass assembly technology using anisotropic conductive film (ACF) is being developed to achieve fine pitch interconnections between driver IC and flat panel display. Conductive adhesives as interconnect materials offer certain advantages in terms of fine-pitch capability and more environment compatibility. Anisotropic conductive film (ACF) is composed of adhesive resin and conductive particles, such as metallic or metal-coated polymer particles. Differ form solder type flip chip interconnection, the electric current passing through conductive particle becomes dominant conduction paths .The interconnection between the particles and the conductive surfaces are constructed by the elastic/plastic deformation of conductive particles with contact pressure which is maintained by tensile stress in the adhesive. Loss of electric contact might occur when the adhesive expanding or swelling in the Z-axis direction, however, delamination and tensile stress crack can occur in the adhesive boundary while the tensile stress is beyond the fracture toughness range. Processing simulations as well as reliability modeling are performed. Nonlinear finite element simulations are used to investigate the contact force development and relaxation within the interconnection during process sequence and the environment al effects such as high temperature. In addition, the parametric study were also be performed. In order to achieve better performance and reliability, variables such as ACF materials, proper processing conditions are discussed. A novel method called equivalent spring method is applied to reduce the CPU time.