Abstract
With the increasing of portable consumer electrical products, the volume of packaging is decreasing. Packaging by anisotropic conductive film (ACF) have paid much attention to its fine pitch, lead free and low temperature manufacture process. We use real IC mounted on PI film by ACF. Then put the specimens aging in different temperatures, high humidity and thermal cycles. After that, we measure the variation of contact resistances and shear strengths of them. On the other hand, the specimens are under both different temperature and frequency by four-point bending fatigue test. We've found that the contact resistances are without changing after environmental aging. But the shear strengths will grow up at the beginning, then decrease to a stable value after 250 hours or 100cycles. In bending test, when test environment temperature increase, fatigue life of low frequency decay faster than high frequency, and the contact resistance will be affected by temperature.