Abstract
Thin Film Transistor- Liquid Crystal Display (TFT-LCD) has been extensively used. Because copper has lower resistivity than aluminum, it is considered an appropriate material for gate TFT-LCD for next generation.One potential technology for this transition is electroless copper plating. Chief performance concern would be the adhesion of copper deposit to the substrate surface. In this study, we attempt to use a new activator, hydrophobic Pd nanoparticles which was developed in our laboratory to improve this technology.In this study, we firmly applied nano-Pdhy in deposition onto glass substrates and compared it with traditional Pd/Sn colloids. Characterization and morphology of Cu film were studied by AA, SEM, XRD and four-point probe.Since Cu film deposited on glass substrates shows serious discontinuation and poor adhesion, ITO substrates were later employed.Cu film deposited on an adequately rough ITO substrates shows good coverage, smoothness and low electrical resistance,~3μΩcm, after annealing at 300℃for 4hr.