Abstract
高功率積體電路（Power Integrated Circuits 簡稱 PIC ）的特性會受 到晶片上高電壓與高輸出電流造成的熱散失所影響。其一般電路的工作溫 度決定於晶片表面上的熱分佈，因此不恰當的設計將造成IC無法正常的工 作。目前，為了降低成本，提高市場競爭力，在同一晶片上加入更多的一 般元件與高功率元件是必然的趨勢（例如智慧型功率元件）。所以IC設計 者有必要在事先考慮熱效應對線路造成的影響，以便適當修正線路架構。 在本論文中，我們提出了一個相當簡單，正確性又高的電熱模型，此模型 適合PIC 設計者使用，因為他只需要簡易掌中型計算機即可得到IC上的溫 度分佈情形，無須藉助電腦進行複雜的計算，可使IC設計者更能掌握線路 的佈局。另外，我們也設計了一個包含有熱源的溫度感應IC，以驗證我們 所提模型的正確性。量測的結果顯示因為一般 DIP 包裝使IC的熱不易發 散，而造成IC內部溫度升高。若減去IC外圍的陶瓷包裝上的溫升，則理論 的模型與量測的結果相當接近。 The design of power integrated circuits (PIC) is strongly influenced by the chip's behavior of dissipating the power produced by high output cu- rrents and high voltages. The electrical characte- ristics of the circuits depend on the thermal dis- tribution on the semiconductor surface. The present trend is to integrate more and more sensing and control circuits with high power devices, such as the smart power families. So, the designer needs to forecast the electrothermal interactions in a very early stage, while designing a power chip. In this paper, three existed temperature- distribution models will be reviewed. And a new modified model is proposed. This new model has no tedious mathematics; yet, it provides very accu- rate results. Also, a temperature sensor IC is designed and fabricated to verify this model. The verification of the models are completed by designing a temperature sensor IC. The modified model has a good match with the measured results if the IC package effect is considered.