Abstract
In recent years, the Central Processor Unit(CPU)’s processing speed is getting faster because of the improvement of Integrated Circuit (IC) technology. However, that would cause the using of power of CPU getting increased. Therefore, the junctions inside the chips would easily be destroyed due to the exceedingly high temperature. Moreover, it will do a great harm to the electronic facilities. Their function, efficiency, workable length and even the reliability will be influenced badly. Especially for the micro-electronic facilities, such as Handing PCs, Notebook Computers, and Cellular Phones…, etc. They are vulnerable to high temperature. Take Notebook Computers as an example, their ability of dissipating heat is limited by the design of the size and interior space which needed to be dealt with by notebook computer producers. In order to conduct this research, Simple Semblable Simulation Method is used. Moreover, an imitating box is made based on the phenomena mentioned above. Then, The Thermal Module System which includes the spreader, fin, heat pipe and fan provided by a factory is used to do this experiment. The Spreader of this Thermal Module System is made by Al Alloy. The reason why using it is because this material has the characteristic of good Heat Conductivity and light weight. In addition, with the use of Al-Alloy spreaders, axial fans, fins and heat-pipes whose main characteristic is to remove heat, the results of dissipating heat can be enhanced. Moreover, through this experiment, the changes of Thermal Resistance caused by natural convection (the integral Thermal Module System works without fans) and the force convection (the integral Thermal Module System works with fans), the system’s heat removing, and the CPU’s temperature changes can be observed. The objective of this research is to observe the phenomena of using regularly used Thermal Module System on notebook computers. By measuring its environmental temperature, the CPU’s center temperature and the distribution of Spreader temperature as well as by adopting Infrared Rays (IR) to know and test the phenomena of heat distribution. “The Step by Step Contrastive Testing” method is adopted in this experiment. That is to make the surface of spreader into black, make some holes on the surface, make the surface with Positive Electrode Treatment, use The Sand-Blasting and Shot Penning onto the surface. At last, to put each spreader of each method into imitating boxes to do the test. After this experiment, something is proven and the results are revealed. The consequences of removing heat can be effective when using Positive Electrode Treatment in Black on 1050 Al-base alloy materials. It is also discovered that using black surface on spreaders can have better results of removing heat than the metal color ones. Besides, the temperature is well distributed which can obviously reduce the temperature of CPU. Moreover, with the use of fans and heat-pipes, notebook computers whose space is small can have better function of heat dissipation and its workable length can also be extended. According to the conclusion, it is suggested to make all the surfaces of Thermal Module System into black in order to effectively reduce CPU’s center temperature and create a safe temperature-control environment.