Abstract
At present diamond grid wire slicing is the tool that uses fixed abrasives to cut ceramic and other brittle materials. Contrast to free abrasive wire slicing, fixed abrasive wire slicing can improve material removal rate and make the diamond grid used efficiently. So it can promote the productivity of material. In order to make the diamond grid wire saw apply to high cost production in semiconductor industry such as wafer slicing. This paper researches the brazed diamond grid wire saw that the KINIK company manufactures. It desires to overcome the defect which diamond drops off easily that sintered or electroplated diamond wire saw has to improve working efficiency. So this paper focuses two key points:1. Improving the condition that the brazed diamond wire easily broken.1. Comparing the sintered、electroplated and brazed three kinds of diamond wire saw through experiment which has wire velocity and working feed rate two parameters .It hopes to find out the difference among the three kinds of diamond wire saw by experimental figures. And hoping to prove the brazed diamond wire saw is better than other two ones in holding diamond grid strength and material removal rate.3. Discussing the brazed diamond wire saw alone. Using the same experimental method and parameters to find out the effect from the experimental parameters and the gap between diamond grid bead by experiment results.