Abstract
Due to bursting development of LED market, highly change and various of requirements, and competition among all sapphire supplier, quality of sapphire and wafer-customization have become fundamental conditions of raising customer satisfaction. Productivity and competitiveness of an enterprise is determined by quality, cost, delivery time of product. During the period of quality improvement, the company may encounter technical problems or bottleneck from manufacturing and product design which all are important factors of causing yield loss. This research took company A as an example. According to cause-effect analysis, the reasons of causing wafer broken and wafer scratch during grind process were operating method of people, attitude management toward job, job transfer between duty-shift and pressure control of equipments. The research not only discussed the root causes of cause-effect generating from people, but also prevents from miscommunication, and job transfer anomaly. To assess one’s proficiency was also one of the management methods mentioned. Through effective human management, job improvement, facility plan and quality control methodology, improvements of decreasing man-made error, and process quality were available, the high yield and low cost can also be acquired. The research predicted that wafer broken and scratch can be decreased through improving factors above. After automatize equipments, one can decreased wafer broken rate, parameters, such as time and pressure, setting error that resulted in wafer thickness out of spec and wafer loss. Through the discussion of results, we could put forward the contribution, limitation and future development.