Abstract
In this paper, the dispensing process for flip chip underfill is discussed by theoretical analysis. Above all the simulation results have considered the properties of chemorheology for the thermosetting polymer, especially the effect of temperature and conversion. Using the collocated cell-centered finite volume method based on three-dimensional calculates the flow field during underfilling process, and predicts the shape and movement of the melt front with time with the method of computation of free surface which solves the volume fraction equation. In regard to the calculation of surface tension, we use continuum surface force (CSF) model. Castro-Macosko Model which considers the effect of conversion and shear rate is induced for providing a described of the resin viscosity change.Because the gap between bumps is slightly larger or smaller than the gap between chip and substrate, Hele-Shaw approximation is not suitable. In the work, we simulation the flow during underfilling process by using the three-dimensional technology and study the effect of temperature, dispensing pattern and bumps on the process further.