Abstract
In this paper, the Underfill encapsulation of Flip-Chip is discussed by theoretical analysis. Above all the simulation results have considered the properties of chemorheology for the thermosetting plastic, especially the effect of temperature. Using the generalized Hele-Shaw approximation calculates the analysis of forces injection encapsulation. Employing the hybrid finite element and finite difference method solves the governing equations. Meanwhile, the power law model is induces for providing a description of the resin viscosity change. The kinetic reaction rate is described by the Kamal equation. Thermal properties of encapsulation are assumed to be constant throughout the entire process.In this study, the conversion in the flip chip encapsulation is very low. The value is about 0.002% to 0.03%. The result show the conversion almost not effect the viscosity change. Otherwise, the inlet pressure should be rise quickly, while changed the distance between the chip and substrate from 0.1mm to 0.2mm. In order to effectively reduce the resistance the substrate could be heated, the simulation results indicate the inlet pressure obviously decrease from 70℃ to 110℃.