Abstract
In terms of the semiconductor and MEMS technology, package is the process that all the devices have to go through before being taking out of the laboratory. In the MEMS field, most of the ways of packaging are adopted from those of the traditional IC packaging, which, however, cannot satisfy the various needs of the modern MEMS devices and also increases the cost of the MEMS devices greatly. This thesis is mainly about the fabrication of the third generation micro gyroscope that our laboratory have developed, the successful design of the structure of the flip chip type packaging, which is able to both transmit electric signal and function the hermetic sealing. With the structure, the packaging of the micro gyroscope has been successfully completed. Furthermore, by using the test vehicle chip, the electric resistance, ranging from 1.8 to 1.9Ω, has been measured from the flip chip solder bump which transmits electric signals. The helium leak rate of the hermetic sealing chamber is 2.4 to 4.8×10-8 atm．cc/s. The result of the research shows that the innovative design of the structure of the flip chip type package demonstrated in the thesis can be applied in the signal transmission and the hermetic package of the multiple I.O. micro device. Moreover, the design can effectively minify the size of the packaging devices as well.