Abstract
Nowadays, electronic packages are developed very fast, therefore the flip-chip ball grid array package is devised for the purpose of achieving the requirements for something which is light, thin, short, small, high speed and high input/output pin counts. However the flip-chip ball grid array package, as a new technology, still has many technical challenges remaining in concern, such as the warpage behavior after the packaging process, and the low cycling thermal fatigue failure which is produced by the solder bump after the accelerated thermal cycling test. These features of the flip-chip ball grid array package in this research work worth further study. Using the element death and birth technology and the finite element global/local analysis model, this study is first to establish an accurate three-dimensional finite element thermal-mechanical analysis model by the ANSYS finite element analysis software.Continuously,the integrated process-dependent analysis simulates for the thermal-mechanical properties which are produced from the chip with Cu/low-k layer of flip- chip ball grid array package after packaging process, including the warpage of the packaging and the strain/stress of the chip, solder bump and the different interfaces of surrounding materials. The validity of the thermal-mechanical analysis model is verified by robotic vision systems inspection (RVSI) and the Twyman-Green interferometry experiments for warpage measurement. In addition, this research explores the elasticity, plasticity and creep behaviors of the solder bump made by different materials, and predicts the fatigue life further when the flip-chip ball grid array package stays in the condition of the accelerated thermal cycling test. At last, this study investigates the effects of related process, materials and geometric parameters on the thermal-mechanical behaviors of this packaging through parametric analysis. The achievement of this study can help us to understand the thermal-mechanical behaviors of the chip with Cu/low-k layer of flip-chip ball grid array package and the reliability under the accelerated thermal cycling test, also offer an initial design stage for electronic packaging industry.