Abstract
Hard and brittle materials has been widely utilized in industrial recently. The growing market of semiconductor and photoelectric industrial require well adapted manufacturing processes to improve the efficiency of thinning machining. Since Ultrasonic Assisted Machining has been proved having advantages of higher removal rates and lower grinding forces, which are profitable in thinning machining, we applied this technology in grinding. In this thesis, motions of the grit of different amplitude of radial ultrasonic vibration assisted grinding are analyzed and a model of ultrasonic vibration assisted grinding are built, which gives a relationship of amplitude and equivalent chip thickness. We proved the above hypothesis according to the test result, which material removal rate, surface roughness, grinding force, specific energy and surface formation are measured and compared to the traditional grinding. According to the test result, the basis of the application of Ultrasonic Assisted Grinding brittle materials has obtained.