Abstract
The manufacturing process technology of semiconductor industry has been rapid improved recently. The high aspect ratio and high density of the IC device cause the higher requirement of the flatness of the SI wafer. The globe planarization has been the key technology of the whole manufacturing processes. The chemical mechanical polishing (CMP) have been wildly used in semiconductor industry for surface finishing as well as globe planarization. The polishing pad is one of the most important consumable in the CMP process. The extending expensive pad life has been the main interest by many researchers. The technology of ultrasonic assisted machining UAM has been successfully used in many machining processes recently. In this project we develop a brand new conditioning process with a UAM dressing head. The slurry came from inside and immediately go back from outside.That we believe can save a lot of slurry, and we may even dressing pad by pure water. This project includes design and manufacturing a new dressing head and some experiments to support this idea. As a result, that added suction-device is faster 4-6 times. The size ratios of the suction are 390W:195W:0W=9.26:6.53:1. The change of water will affect the amount of the powdered iron on the pad. The little water you add, the worse result you get. But if the water is added up to a certain extent, the speed of the powdered iron taking away by water is almost the same. Ultrasonic vibration could make powdered iron active and easier to be removed by water or suction-device. The speed-ratio of decrease of powdered iron was 6μm: 3μm: 0μm=1.3: 1.07: 1. The result is more apparent as long as the amplitude bigger.