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運用 IS0 10303應用協定進行印刷電路組裝資料模組建構和可組性分析
Thesis

運用 IS0 10303應用協定進行印刷電路組裝資料模組建構和可組性分析

徐政斌
Masters, 國立清華大學, 工業工程與工程管理學系
1997

Abstract

同步工程 產品資料交換標準 印刷電路組裝 應用協定 AP 210 cocurrent engineering application protocols PCB assembly STEP
Today, time is one of key factors in making a company to be the best in its industry. Translating information correctly and efficiently would not only reduce the time required to communicate between departments within a company, but it is also between different companies. STEP, comprising of many application protocols, is a standard for the exchange of product model data that has a great capability of describing product shape and managing product information. Therefore, effective information translation and the Concurrent Engineering (CE) concept would be implemented by STEP. AP 210, a committee draft document, is an application protocol that describes PCB Assembly product design data. This paper focuses on the data modeling of PCB Assembly that based on STEP. Moreover, a physical data base developed by those data models is used for the decision analysis application program which will do some critical analysis work about PCB Assembly.

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