Abstract
The process of semiconductor fabrication is very complex and expensive materials, precise machines and high-standard environment are required for the entire production. High cost and low life cycle have been two of the characteristics of semiconductor industry. How to enhance yield such that the manufacturing cost can be reduced has become one of the most important issues. Finding out factors that may affect yield and continuing to keep track of these factors in the design phase with production design engineers is a good method to effectively improve yield. The purpose of the Chemical Mechanical Polishing (CMP) process is to planarize heights caused by the deposition of thin films such that further levels may be added onto a flat surface.