Abstract
ABSTRACT Nowadays, electronic devices are being pushed toward high density, lightweight and miniaturization. Metal nanowire-based anisotropic conductive film (ACF) flip chip (FC) packaging technology can be applied to ultra fine pitch interconnection. However, metal nanowire-based ACF FC packaging, as a new technology, still has many technical challenges remaining in concern, such as the thermal-mechanical behavior of this packaging during the thermal bonding process in manufacture sequences. These features of the Metal nanowire-based ACF FC packaging in this research work worth further study. Using transient heat transfer and contact analysis models, this study is first to establish a three-dimensional finite element transient thermal-mechanical analysis model with ANSYS program. Continuously, an integrated process-dependent analysis including the contact stress on the bumps and electrodes, the peeling stress at the different interfaces of the non-conductive past (NCP) and surrounding materials and the warpage of the packaging is provided. The validity of the thermal-mechanical analysis model is verified by thermal couple and laser Moir□ experiments for warpage measurement. At last, this study explores the effect of related process parameters on the thermal-mechanical behaviors of this packaging through parametric analysis. The achievement of this study can help us to understand the thermal-mechanical behavior of this metal nanowire-based ACF FC packaging during thermal bonding process, also offer an initial design stage for electronic packaging industry.