Abstract
Thin film materials are basic components of micro solid-state devices. There will be a great contribution to efficiency and heat transfer characteristics of micro devices if we can understand the thermal conductivity properties of thin films efficiently. Furthermore, it will be related to lifetime of micro devices. When the dimension of thin film material shrunk down to micron or nano scale, the thermal conductivity of thin film will be different from its bulk material property. Hence, in past ten years recently, some reliable experimental techniques are developed to measure thermal conductivity of thin films. In this thesis, thermal conductivity of metal thin films are measured by 3ω method and heat pulse method, respectively. And this study evaluated the feasibility and accuracy of two experimental techniques from the problems and data results obtained in measurement steps.