Abstract
At present, ceramic materials are extensively used in substrate materials of semiconductor, mechanical and photoelectric devices. Not only brittle materials are very hard to machining, but also the requirement increase with time. Free abrasive machining for brittle materials had been used in the past, however its efficiency was so low and waste a lot of slurry. In order to gain high accuracy and fine surfaces quality in industrial requirement more efficiently, so this paper uses Fixed Diamond Wire Saw to slice Silicon Carbon and Alumina. To analyze saw slicing properties and measure surface roughness, we use SEM to measure chip formation of ceramic materials. These methods can help us to know the brittle fracture mode and ductile regime grinding mode in ceramic materials remove modes. Finally, we condition parameters to gain ductile regime grinding mode of slicing ceramic materials. These methods can slice more efficiently and improve surface roughness more excellently. Ductile regime produces thin deteriorate layer and increases requirement of industry.