Abstract
Microelectromechanical system (MEMS) contains microsensors, microactuators, micromechanical structures, and integrated circuits. Since the micromachining fabrication processes are improved drastically, plenty of micromachined devices have been developed and commercialized presently. However the applications of these devices are still limited by traditional IC planar fabrication process. Three-dimensional devices are needed to contact, react, or communicate with the real world.This research intends to develop a novel self-assembly three-dimensional microstructure. Combine with microactuators, positioning grooves, and microbridges to satisfy the demands of high precision and array-type assemble simultaneously. From the study, the technology of design, analysis, fabrication, and measurement of an out-of-plane micromirror with a special angle are established.