Abstract
Calculating interfacial stresses by multilayer theory to predict the reliability of electronic package and MEMS structures are widely used for years. Nowadays, electronic package and MEMS structures are much smaller and thinner, so the mesh density of finite element analysis is rising, and the CPU time of computer simulation is increasing. Because multilayer theory has the distinguishing characteristic of fast calculation, multilayer theory analytical solutions can save more time than finite element analysis numerical solutions.This research is based on the multilayer theory models, subsequently makes a series of comparison and analysis between finite element analysis numerical solutions and multilayer theory analytical solutions. This work not only discuss the property and the workability of theories but also fabricate multilayer structure made by silicon substrate to demonstrate the feasibility of finite element method and multilayer theories by experiment method.In order to discuss and compare the character of multilayer theories, this work applies finite element method on similar theories to make some comparison and analysis for application range as well as prediction ability of the theories. In multilayer structure with thermal loading experiment, after measurement and analysis, It is found find that the trend of out of plane displacement experimental value of multilayer structure is corresponding to the trend of finite element analysis numerical solution. Thereby this result demonstrate that it is a feasible way to predict the mechanical behavior of multilayer structures by finite element method, and also find a reliable basic tool for multilayer theory demonstration.Keywords: Finite element analysis, Multilayer theory, Electronic package, MEMS