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電子構裝材料受溼度影響之機械性質
Thesis

電子構裝材料受溼度影響之機械性質

林鴻穎
Masters, National Tsing Hua University
2000

Abstract

電子構裝材料特性濕度影響 electronic packagingmaterial characterizationhygro effect
Analysis and experiment for the mechanical behavior of increasing and decreasing moisture in 3D MCM constituent polymer materials have been carried out. In experiment, the diffusion process of increasing and decreasing moisture of the 3D MCM constituent polymer materials were performed in the hygrothermal chamber and oven. The electronic balance was used to measure the net weight gain and loss of the 3D MCM constituent polymer materials.In analysis, the characteristic curves of material models of 3D MCM constituent materials were established to assess, the moisture dependent properties of electronic materials based on the experimental results.

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