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電子組裝製造屬性展開─取置製程
Thesis

電子組裝製造屬性展開─取置製程

謝仁豪
Masters, 國立清華大學, 工業工程與工程管理學系
2003

Abstract

表面黏著技術 製造屬性展開 可製性分析 反向設計鏈分析 Surface Mount Technology Manufacturing Attribute Deployment Manufacturability Reverse Design Chain Analysis
The purpose of the research is to establish an integrated mechanism between manufacture and design department. Starting in placement machine for printed circuit board assembly lines to make design department learn manufacturing resource constraints of machines previously. Design department can take manufacturability into account and analyze failure data from process/product to inference design rules. The benefits are reducing times of engineering change notice, decreasing cost, and speeding new product introduction. The achievements and contributions of the research include: 1.According to manufacturing resource constraints and failure data from process/product, the research uses manufacturing attribute deployment (MAD) and failure analysis to establish manufacture attributes of placement machine and related design attributes to inference design rules. 2.Using program languages (HTML and VBA) to construct an user interface. It has following functions: (a)User can type in design attribute value of board and components and the interface will check with constraints and design rules in the database. (b)It can compute the process time and look up specification of shape, hole on stencil, silk screen, and pad of components. (c)It can look up constraints of board and component design attributes, related design rules, approval vender list, and common problems in the database. (d)Because of using web-based structure, all departments and partners can look up and maintain the information in the database together. 3.Using the user interface, it can find out the problems that CAD can’t detect. Such as the height and weight of components.

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