Abstract
本研究主要在探討積體電路封裝中所使用的環氧樹脂封裝材在轉移 成型 過程中之黏度變化特性。 研究高程度填充封裝材剪切致稀、 降伏應力現象及凝膠點的決定之三大特性。 利用穩態和動態量測方 式探討EMC的化學流變及懸浮流變現象，並比較兩者實驗 結果發現動態 量測方式在量測上似乎是較能表現EMC流變行為。 修改Castro- Power law Model以期能正確預測EMC在封膠過程中之流變行為特性。 This paper is aimed to study the variation of viscosity of epoxy molding compounds(EMC) used for the encapsulation of Integrated Circuits during the transfer molding process. This paper touches on three issues related to the viscosity of high loading level molding compound: phenomenon of shear- thinning, yield stress and the determination of gel point. Steady and dynamic analysis methods are used to investigate the chemorheology and suspension rheological character of EMC. After comparing these two approaches, it*s found that dynamic method seems to be a better way for characterizing EMC rheology. Then Castro-Power law Model are modified in order to capture the rheological behavior of EMC during the encapsulation process.