Abstract
Copper alloy reinforce with vapor-grown carbon fiber (VGCF) was fabricated in order to improve mechanical properties of original materials has been reported in this studied. Cu alloy powder with 0.4 mass% Ti was mixed with Clesafe oil facilitate coating of VGCF on alloy powder by ball milling before mixing with VGCF by rocking mill. Spark plasma sintering (SPS) was performed at 1223 K in vacuum and 30 MPa load was applied during SPS. Cylindrical specimens were extruded with preheating temperature at 1073 K. As a result, Cu-Ti alloy specimen without VGCF shows yield stress and electrical conductivity at 254.7 MPa and 46.0 IACS% respectively. It appears that yield strength of Cu-Ti/VGCF composite material is inferior than original alloy but electrical conductivity is improved. Copper-Silicon alloy reinforced with VGCF was also fabricated with same procedure in purposed of comparing with Cu-Ti/VGCF composites. Hardness and electrical conductivity of this material was degraded compared with original alloy.