Abstract
MEMS technology is one of the most important technology in 21st century. Recently, the design and development of micro-device become more and more important. As the complication of the device increases, the micro-fabrication becomes more difficult. Traditional MEMS technology such as bulk micromachining, surface micromachining, DRIE cannot be used to fabricate multilayers high aspect ratio structures. After combing the micro-electroplating and chemical mechanical polishing (CMP) technology, the multilayer high-aspect-ratio metal technology is successfully developed in this study. This technology is capable of fabricating a complicated three -dimensional microdevices with arbitrary stacked geometry and less than 1mm arbitrary height. This technology can be further developing into a standard process to integrate different device into single wafer. It is a very useful process to fabricate advanced microsystems in the future. Using simulation softwares, micromirror arrays actuated by vertical comb drives are designed to rotate within the rotation range over ±5°. Each mirror of the micromirror array can be individual controlled linearly. Comparing with silicon structure, the multilayers high aspect ratio metal technology offers more robust and better electromagnetic performance devices. By first developing the design rules, linear positioning micromirror 1D arrays are successfully fabricated with optimized process condition.