Logo image
130-mm2, 256-Mbit NAND flash with shallow trench isolation technology
期刊文章

130-mm2, 256-Mbit NAND flash with shallow trench isolation technology

Kenichi Imamiya, Yoshihisa Sugiura, Hiroshi Nakamura, Toshihiko Himeno, Ken Takeuchi, Tamio Ikehashi, Kazushige Kanda, Koji Hosono, Riichiro Shirota, Seiichi Aritome, …
IEEE Journal of Solid-State Circuits, 卷.34(11), 頁碼.1536-1543
11/1999

摘要

Electrical and Electronic Engineering
A 256-Mbit flash memory has been developed using a NAND cell structure with a shallow trench isolation (STI) process. A tight bit-line pitch of 0.55 μm is achieved with 0.25-μm STI. The memory cell is shrunk to 0.29 μm 2 , which realizes a 130-mm 2 , 256-Mbit flash memory. Peripheral transistors are scaled with memory cells in order to reduce fabrication process steps. A voltage down converter, which generates 2.5-V constant internal power source, is applied to protect the scaled transistors. An improved bit-line clamp sensing scheme achieves 3.8-μs first access time in spite of long and tight pitch bit-line. A 1-kbyte page mode with 35-ns serial data out realizes 25-Mbyte/s read throughput. An incremental step pulse with a bit by bit verify scheme programs 1-k cells in 1-V Vt distribution within 200 μs. That realizes 4.4-Mbyte/s programming throughput.

相關連結

指標

1 檢視次數

詳細資料

Logo image