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30.3 Self-Aligned Double Patterning-Aware Detailed Routing with Double Via Insertion and Via Manufacturability Consideration
期刊文章

30.3 Self-Aligned Double Patterning-Aware Detailed Routing with Double Via Insertion and Via Manufacturability Consideration

Yixiao Ding, Chris Chu 和 Wai-Kei Mak
Proceedings - ACM IEEE Design Automation Conference, 卷.53(1), 頁碼.242-247
2016

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