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3.3 kV Class 4H-SiC Double-Implanted MOSFET with Excellent Radiation Hardness Against Gamma Rays using Counter-Doped Junction Termination Extension
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3.3 kV Class 4H-SiC Double-Implanted MOSFET with Excellent Radiation Hardness Against Gamma Rays using Counter-Doped Junction Termination Extension

Jheng-Yi Jiang, Chen-Xuan Tu, Jia-Wei Hu, Der-Sheng ChaoChih-Fang Huang
IEEE Electron Device Letters
2021

摘要

gamma rays Gamma-rays Insulated gate bipolar transistors JFETs Logic gates MOSFET MOSFET radiation hardness SiC Silicon Silicon carbide Electronic Optical and Magnetic Materials Electrical and Electronic Engineering
In this letter, we report experimental results for a 3.3 kV class 4H-SiC double-implanted MOSFET (DMOSFET) that provides excellent radiation hardness against gamma rays using the counter-doped junction termination extension technique. At a total dose of 700 kGy at room temperature, the ON-state current is only degraded by 15%, and the breakdown voltage remains above 3.5 kV with a clear avalanche feature. In contrast, Si insulated gate bipolar transistors (IGBTs) are not able to maintain both its forward and reverse specifications, even at 1 kGy.

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