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A 3D profiling system using thermoresistive sensing and image processing with stepwise pixel patching
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A 3D profiling system using thermoresistive sensing and image processing with stepwise pixel patching

Teng-Chung Liu, Padmanabh Pundrikaksha Pancham, Ming-Tse Yuan, Yu-Wen Chen, Cheng-Han Tsai 和 Cheng-Yao Lo
Measurement : journal of the International Measurement Confederation, 卷.249, 頁.117073
31/05/2025
Web of Science ID: WOS:001434779500001

摘要

Aerogel Image processing Joule heating Strain detection Surface profiling Thermoresistive
•Supportiveness on isotropic strain detection,•Improved uniformity with high spatial resolution,•Eligibility of decoupling serial connection of tensile and compressive strains, and.•Integrated graphical user interface for easy control. A thermoresistive strain sensing system with a concentric-like pattern, a special thermal insulator (aerogel), and integrated graphical user interface (GUI) for strain visualization was proposed and demonstrated in this work. The temperature responses were resulted from the contribution of resistance change and the current that flowed through the sensor with Joule heating. The aerogel between the sensor and the demonstrators avoided misleading material-induced heat dispassion, leading to improved accuracy. The GUI was coded through Matlab that converted two-dimensional thermal images into three-dimensional (3D) profiles through an established temperature − profile database for operation simplicity. In addition, a stepwise signal processing on pixel patching further optimized the visual perception of the 3D profile for practicality. The proposed system not only decoupled the serial connection of tension and compression, but also correctly indicated arbitrary strain orientations without any blind spots. The maximum tolerance was found to be lower than 9.3 % and the converted 3D profiles showed remarkable reconstruction of the object of interest with a coefficient of determination of 0.961; demonstrating a novel, non-contact, and integrated profiling system with optimized signal processing for mechanical applications.

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