摘要
In this paper, a model is proposed to more closely describe the relationships between polishing parameters and the material removal rate for the commonly used storage disks in PC. Experiments were conducted to verify this model. It is shown that the proposed model predicts the material removal rate more accurately than existing models. The proposed model is expected to apply to different materials polished by similar processes. The FEM analysis of the applied polishing pressure well explained the current empirical results.