A Material Removal Model in Chemical Mechanical Planarization of Silicon Dioxide Film and Bare Silicon Wafer

Journal article

International Journal of Chemical Mechanical Planarization International Journal of Chemical Mechanical Planarization, Vol.1(1), p.90

1999

Abstract

Material Removal Model;Chemical Mechanical Planarization;Silicon Dioxide Film;Bare Silicon Wafer

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Title: A Material Removal Model in Chemical Mechanical Planarization of Silicon Dioxide Film and Bare Silicon Wafer
Creators - without role: H. Hocheng - 國立清華大學工學院動力機械工程學系
H.Y. Tsai
Publication Details: International Journal of Chemical Mechanical Planarization International Journal of Chemical Mechanical Planarization, Vol.1(1), p.90
Identifiers: 9957773042306774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Journal article