摘要
A 300-MHz class-E dc-dc converter using the resonant gate driving technique is proposed. The gate driver utilizes the harmonic shaping network and RC feedback to enhance the output swing voltage, and the class-E power converter can minimize the voltage-current overlap to improve efficiency. With the 0. 25-μm GaN high-electron-mobility transistor and 0.18-μ m CMOS for the switching power device and the gate driver, respectively, a complete dc-dc converter operating at 300 MHz is demonstrated including all the passive components microfabricated by integrated passive device (IPD) technology on the high-resistivity silicon substrate. The overall chip area is smaller than 1 cm × 1 cm and the volume is only 0.115 cm 3 . The measured results show a maximum output power of 4.16 W with 47.3% efficiency. An excellent power density of 36.2 W/cm 3 can be achieved. The flip-chip assembled converter on the IPD substrate demonstrates the potential of heterogeneous integration for high-frequency power conversion applications.