摘要
With the rising demand for high-speed data transmission, silicon photonics has emerged as a key technology for next-generation data centers and optical communications due to its cost-effectiveness and high performance. However, current wafer testing remains inefficient and unstable, relying heavily on manual or semi-automatic methods, which significantly hinder production scalability. This study proposes the world's first fully automatic measurement system for 12-inch silicon photonics wafers. It adopts a modular, three-layer control architecture-comprising driver, I/O, and application layers which integrates real time computing and distributed data management to support multi-brand instruments and automation platforms, enabling highly modular and collaborative system architecture. This overcomes common challenges in mass production such as hardware-software incompatibility and inflexible production scheduling. Experimental results show that the system reduces average testing time from 146.38s to 44.97s, resulting in a 3.29-fold increase in throughput. Key steps such as laser setup and data logging present time reductions of 99.94% and 98.32%, respectively. The instrument-to-stage time ratio improved from 3.33:1 to 0.15:1, boosting overall efficiency by 69.27%. Academically, to the best of our knowledge, this study is the first fully validated fab-level solution for automatic silicon photonics measurement. Practically, the system enables high-speed, stable, and scalable testing, laying a solid foundation for the advancement of smart manufacturing.