摘要
This paper presents a novel on-wafer self-powered wireless sensing module for extreme ultraviolet (EUV) lithography, advancing prior designs through the integration of a Gate Voltage Controlled Oscillator (GVCO) and an optimized ultra-thick metal on-chip antenna (OCA) for enhanced stability and transmission properties. The surface sensing pad captures incident photons, inducing energy via a coupling device to control the GVCO, whose output frequency reflects real-time EUV intensity. The output frequency signal can be wirelessly transmitted to the receiver through an OCA. It enables real-time monitoring of on-wafer EUV exposure parameters in advanced lithography systems without an external power source, thereby facilitating the yield control of advanced CMOS processes.