Abstract
A study to prevent the sticking of the microstructure during the drying process, using a novel technique was presented. The dynamic response of the microstructure including resonant frequency and the damping characteristic of the drying system was predicted using the proposed antistiction method. The experimental results were found in good agreement with the theoretical predictions of the dynamic behavior of microstructures during the drying process. The yield rate of the microstructure without additional masks and complicated process during the postetch release process was efficiently improved using the proposed approach.