Abstract
An electroplating technique for detecting high-resistance faults in failure analysis task was analyzed. The technique uses simple equipment and can pinpoint a defect site with resistance below 1K ω and can observe the failure site under an optical microscope. The method identifies cross-sectional focused ion beam image along the path of the floating and requires complicated and expansive equipment. The technique can be applied in devices with logical circuits along with voltage contrast to determine if the suspected path has an open fault.