摘要
Multiple material additive manufacturing technology with the capability to integrate glass-ceramic and metallic materials is essential to the development of high-performance functional components for high temperature applications. Here we show the feasibility and characteristics of additively manufactured glass-ceramic/metal 3D electronic components via single-process multiple material laser powder bed fusion (MMLPBF). Copper (II) oxide (CuO) powder is mixed with α-spodumene (lithium aluminosilicate, Li 2 O·Al 2 O 3 ·4SiO 2 ) glass-ceramic powder to improve the laser absorbance, reduce the melting point of glass-ceramic to match that of copper and to improve bonding between copper and the glass-ceramic. Up to 92% relative density of the glass-ceramic is realized. The monoclinic crystal α-spodumene has been transformed to tetragonal crystal β-spodumene after laser melting. Sodium chloride (NaCl) and graphite mixed powder is printed as the substrate for the glass-ceramic component for its rapid removal. Embedded conductive copper wires and plates as the main conductive structures are successfully built within the glass-ceramic from powder feedstocks. The electrical resistivity of the printed copper structures is examined. An embedded multiple layer electric circuit, a capacitor and a temperature sensor are successfully printed and tested.