摘要
Circuit probe is crucial for electrically testing for functional defects to determine the known good dies before integrated circuit (IC) packaging. Semiconductor probe forming showing quality characteristics with highly correlated responses, yet little research has been done to develop effective solution for optimizing the parameters for probe precision forming. In practice, process parameters for probe forming need to be adjusted when some response variables become out of the specifications owing to degrading of production conditions, most companies rely on domain knowledge and trial-and-error approach. As IC critical dimensions are shrinking, the present problem for probe precision forming is increasingly challenging and critical for data integrity of circuit probe test for yield enhancement of IC products. Focusing on realistic needs, this study aims to develop an effective solution for real-time parameter optimization in light of changing production conditions based on design of experiment, partial least square, and genetic algorithm for advanced quality control to enhance data integrity of circuit probe test. The results of an empirical study have shown that the proposed approach can significantly enhance the effectiveness and efficiency of parameter optimization in real setting. Indeed, the developed solution has been implemented with significant advantages.