摘要
Ag–Sb alloys are promising materials in joining applications and Cu is frequently encountered in electronic and thermoelectric devices. This study examines the Ag-41.0 at%Sb/Cu interfacial reactions and the phase equilibria isothermal sections of Ag–Cu–Sb at 300 °C and 500 °C. The Ag–Sb eutectic is reexamined and is at Ag-42.0 at%Sb and at 484.5 °C. No ternary compound is observed in the Ag–Cu–Sb system. It is found the ternary solubilities in the binary compounds in the Ag–Cu–Sb system are not significant. The highest is 4.7 at.% Cu in the Ag 7 Sb compound. Two reaction phases, Cu 2 Sb and Ag 3 Sb, are formed in the Ag–Sb/Cu couples reacted at 300 °C. Three reaction phases, Cu 2 Sb, Cu 3 Sb and Ag 3 Sb, are formed in the Ag–Sb/Cu couples reacted at 500 °C. The reaction rate in the couples reacted at 500 °C is very fast, and the reaction layer is 89 μm thick in the couple reacted for 4 min.