摘要
High-temperature-resistant thin-film sensors can quickly and accurately obtain signals such as temperature, heat flux, and strain from surfaces in high-temperature applications, and the reliability of the sensors is determined by the quality of the lead electrical connection structure of the high-temperature-resistant thin-film sensors. Aiming at the challenges of complicated process and high cost of the lead electrical connection structure of high temperature resistant thin-film sensors, a lead electrical connection structure is proposed based on polymer-derived ceramics (PDC). The lead connector was prepared using a high-temperature wire and polymer-derived ceramics, and then the lead connector and the lead film were sintered together by PDC paste to obtain the electrical connection between the lead film and the high-temperature wire. The surface morphology and electrical properties as well as the high-temperature stability of the lead connector were characterized, and the proposed lead electrical connection structure was also used for polymer-derived ceramic thin-film thermistors, and multiple rounds of resistance temperature tests were conducted from room temperature to 800 °C. The results show that the lead connector has an oxide layer on the surface and a conductive layer on the inside, and the structure can withstand temperatures up to 1100 °C with good high-temperature stability, which makes it possible to be used for high-temperature-resistant polymer-derived ceramic thin-film sensors. A low-cost and simple process high-temperature lead electrical connection structure is provided for high-temperature-resistant thin-film sensors. © 2025 Elsevier Ltd and Techna Group S.r.l.