Abstract
This study aims to develop a UNISON decision framework for analysing the inspection frequency decisions for the advanced wafer bumping process. Since the accumulated values of the wafers fabricated in wafer fabs are high, process excursion and defects in bumping will cause serious loss. Thus, it is critical to determine the inspection frequency to fulfil the requirement of mass production while ensuring the yield. For validation, an empirical study was conducted in a bumping company and the results showed practical viability of the proposed approach. Copyright © 2008 Inderscience Enterprises Ltd.